The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2010
Filed:
Oct. 19, 2007
Se-young Jeong, Seoul, KR;
Sung-min Sim, Gyeonggi-do, KR;
Soon-bum Kim, Gyeonggi-do, KR;
In-young Lee, Gyeonggi-do, KR;
Young-hee Song, Gyeonggi-do, KR;
Se-Young Jeong, Seoul, KR;
Sung-Min Sim, Gyeonggi-do, KR;
Soon-Bum Kim, Gyeonggi-do, KR;
In-Young Lee, Gyeonggi-do, KR;
Young-Hee Song, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
An interconnection structure includes an integrated circuit (IC) chip having internal circuitry and a terminal to electrically connect the internal circuitry to an external circuit, a passivation layer disposed on a top surface of the IC chip, the passivation layer configured to protect the internal circuitry and to expose the terminal, an input/output (I/O) pad, where the I/O pad includes a first portion in contact with the terminal and a second portion that extends over the passivation layer, and an electroless plating layer disposed on the I/O pad.