The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2010
Filed:
Feb. 26, 2004
Min Wee Low, Singapore, SG;
Tian Siang Yip, Singapore, SG;
Min Wee Low, Singapore, SG;
Tian Siang Yip, Singapore, SG;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method to assemble a non-leaded semiconductor package is disclosed. In one embodiment, a carrier tape is attached to a metal foil. A plurality of leadframes are formed in the metal foil, each leadframe including a die pad laterally surrounded by a plurality of contact leads. A semiconductor die, including an active surface with a plurality of die contact pads, is attached to each die attach pad and electrically connected to the leadframe by a plurality of bond wires connecting the die contact pads and the lead contact areas of the contact leads. A plurality of leadframes, each including a wire bonded semiconductor die, are encapsulated with mold material. The carrier tape is removed and the non-leaded semiconductor packages separated.