The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2010

Filed:

Feb. 22, 2006
Applicants:

Shigemi Ohtsu, Ashigarakami-gun, JP;

Toshihiko Suzuki, Ashigarakami-gun, JP;

Keishi Shimizu, Ashigarakami-gun, JP;

Kazutoshi Yatsuda, Ashigarakami-gun, JP;

Akira Fujii, Ashigarakami-gun, JP;

Eiichi Akutsu, Ashigarakami-gun, JP;

Inventors:

Shigemi Ohtsu, Ashigarakami-gun, JP;

Toshihiko Suzuki, Ashigarakami-gun, JP;

Keishi Shimizu, Ashigarakami-gun, JP;

Kazutoshi Yatsuda, Ashigarakami-gun, JP;

Akira Fujii, Ashigarakami-gun, JP;

Eiichi Akutsu, Ashigarakami-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A sub-mount for mounting optical components includes a recess for mounting whose side wall is tapered. A light transmission and reception module includes the sub-mount for mounting optical component. The sub-mount is manufactured by forming a master mold of the sub-mount formed with projections and recesses including the recess for mounting of the sub-mount, applying liquid silicone rubber to the mater mold, curing the liquid silicone rubber to produce a mold for duplication, filling the curable material into the mold for duplication, curing the curable material, and separating the cured curable material from the mold for duplication.


Find Patent Forward Citations

Loading…