The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Aug. 17, 2006
Po-yuan Liu, Hsinchu, TW;
Chuan-mau Wei, Hsinchu Hsien, TW;
Chih-yuan Chien, Taipei, TW;
Au Optronics Corp., Hsinchu-Chu, TW;
Abstract
A structure for circuit assembly is applied to positional alignment in bonding process. The structure for circuit assembly comprises a first substrate, having a plurality of first terminals and both a first alignment mark and a second alignment mark located in the vicinity of the first terminals, and a second substrate, having a plurality of second terminals and a transmissive area located in the vicinity of second terminals. During the first substrate bonding with the second substrate, as the edge of the transmissive area is located between the first alignment mark and the second alignment mark, and the first alignment mark is outside of the transmissive area, the first terminals are normally connected with the second terminals.