The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Feb. 05, 2004
Shinji Mizuno, Kanagawa, JP;
Koji Mitsui, Kanagawa, JP;
Katsutoshi Yanoshita, Kanagawa, JP;
Shinichi Suzuki, Kanagawa, JP;
Takashi Shinoki, Kanagawa, JP;
Kazutaka Nakagome, Kanagawa, JP;
Naoki Fukuda, Kanagawa, JP;
Kozo Morita, Kanagawa, JP;
Daisuke Makino, Kanagawa, JP;
Shinji Mizuno, Kanagawa, JP;
Koji Mitsui, Kanagawa, JP;
Katsutoshi Yanoshita, Kanagawa, JP;
Shinichi Suzuki, Kanagawa, JP;
Takashi Shinoki, Kanagawa, JP;
Kazutaka Nakagome, Kanagawa, JP;
Naoki Fukuda, Kanagawa, JP;
Kozo Morita, Kanagawa, JP;
Daisuke Makino, Kanagawa, JP;
Teikoku Tsushin Kogyo Co., Ltd., Kanagawa-ken, JP;
Abstract
An electronic component substrate (-) includes an insulating base () and a flexible circuit board () mounted on the insulating base (). The flexible circuit board () is a synthetic resin film provided thereon with terminal patterns () and a conductor pattern () whose surface is slidingly contacted with a slider. The insulating base () is a synthetic resin molded piece. The flexible circuit board () is insert-molded to the insulating base (). The electronic component substrate (-) is produced by preparing the flexible circuit board () and first and second mold members () having a cavity (C) with a shape that corresponds to the external shape of the electronic component substrate (-). Then, the flexible circuit board () is accommodated in the cavity (C) between the first and second mold members (), and the cavity (C) is filled with a molten molding resin. After the molding resin has solidified, the first and second mold members () are removed.