The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Jul. 17, 2007
Isamu Aokura, Osaka, JP;
Toshiyuki Fukuda, Kyoto, JP;
Yukitoshi Ota, Osaka, JP;
Keiji Miki, Kyoto, JP;
Isamu Aokura, Osaka, JP;
Toshiyuki Fukuda, Kyoto, JP;
Yukitoshi Ota, Osaka, JP;
Keiji Miki, Kyoto, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A semiconductor device in accordance with the present invention includes IC chips (semiconductor elements) () having solder bumps () (projecting electrodes) formed on electrode pads, and a first wiring board () having connection terminals () to which the respective solder bumps () of the IC chips () are connected, external connection terminals () for connection to an external apparatus, and conductor wires () provided in respective groove portions formed in a board surface and connected to the respective connection terminals (). In spite of the reduced pitch of the conductor wires (), the presence of the groove portions enables an increase in cross section, allowing a reduction in wiring resistance.