The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7728424 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 01, 2010

Filed:

Jul. 27, 2006
Applicants:

Tatsuhiko Asakawa, Fujimi-machi, JP;

Hiroki Kato, Suwa, JP;

Inventors:

Tatsuhiko Asakawa, Fujimi-machi, JP;

Hiroki Kato, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device including: a semiconductor substrate having an electrode; a resin protrusion formed on a surface of the semiconductor substrate on which the electrode is formed, the resin protrusion extending along a straight line and having a sloping region of which a height decreases along the straight line as a distance from a center of the resin protrusion increases; and an interconnect electrically connected to the electrode and extending over the sloping region of the resin protrusion.


Find Patent Forward Citations

Asakawa, Tatsuhiko. (2010). Semiconductor device and method of manufacturing the same (U.S. Patent No. 7728424). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7728424

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