The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Dec. 18, 2007
Applicants:
Donghan Kim, Gyenggi-do, KR;
Kiwon Choi, Gyenggi-do, KR;
Inventors:
Donghan Kim, Gyenggi-do, KR;
Kiwon Choi, Gyenggi-do, KR;
Assignee:
Samsung Electronics Co., Ltd., Maetan-dong, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
One embodiment of a semiconductor package described herein includes a substrate having a first through-hole extending therethrough; a conductive pattern overlying the substrate and extending over the first through-hole; a first semiconductor chip facing the conductive pattern such that at least a portion of the first semiconductor chip is disposed within the first through-hole; and a first external contact terminal within the first through-hole and electrically connecting the conductive pattern to the first semiconductor chip.