The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
May. 19, 2005
Bernold Richerzhagen, St-Sulpice, CH;
Akos Spiegel, Chavannes, CH;
Bernold Richerzhagen, St-Sulpice, CH;
Akos Spiegel, Chavannes, CH;
Synova SA, Ecublens, CH;
Abstract
The invention relates to a device () for cutting wafers () into a number of chips with a laser beam () injected into a liquid jet (). A thin flowing liquid layer () having a blasting effect is produced on the surface () of the wafer (). This makes it possible to prevent projections resulting during laser cutting from depositing once again on the surface of the wafer. The result is a very high cleanness of the surface after the cutting process. The liquid layer () is produced, in particular, so that it is thinner in a machining area () around the machining point () than outside of the machining area (). This ensures that the liquid layer is sufficiently thin () at the machining point () so that enough laser energy for removing material is applied to the wafer surface, and ensures that the liquid layer is sufficiently thick () outside of the machining area so that no area of the surface () of the wafer () dries out.