The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Jan. 03, 2008
Tetsuo Nishidate, Daito, JP;
Tetsuo Nishidate, Daito, JP;
Funai Electric Co., Ltd., , JP;
Abstract
In the case of connecting a flexible substrate to a counterpart substrate by soldering, the area of a dead space on the counterpart substrate due to being covered with the flexible substrate is reduced to reduce the outside dimension of the counterpart substrate. Solder landsandon the flexible substrateare soldered to solder landsandon the counterpart substrate. The flexible substrateis divided into two branching piecesandby an incisionor a slitformed in such a manner as to extend from an intermediate part in the arrangement direction R of circuit patterns to the leading end of the flexible substrate. The space between the solder landsandon the respective piecesandis made equal to the space between the two spaced-apart solder landsandon the counterpart substrateby placing the piecesandformed by dividing the flexible substrateon one another.