The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2010
Filed:
Aug. 23, 2006
Kazumasa Kobayashi, Sodegaura, JP;
Chiaki Asano, Tokyo, JP;
Hiroshi Sato, Sodegaura, JP;
Yasuyuki Takeda, Sodegaura, JP;
Kazuhiko Yoshida, Sodegaura, JP;
Kazumasa Kobayashi, Sodegaura, JP;
Chiaki Asano, Tokyo, JP;
Hiroshi Sato, Sodegaura, JP;
Yasuyuki Takeda, Sodegaura, JP;
Kazuhiko Yoshida, Sodegaura, JP;
Nippon Steel Chemical Co., Ltd., Tokyo, JP;
Abstract
Disclosed is an epoxy resin composition which is solid at ordinary room temperature, cures with excellent light resistance and heat resistance and minimal shrinkage, and is useful for encapsulating LEDs. The epoxy resin composition is characterized by comprising as an essential component an epoxy resin having an epoxy equivalent of 300-1000 g/eq and a softening point of 65-110° C. obtained by reacting a nonaromatic polycarboxylic acid (A) having an acid value of 100-250 mgKOH/g with a nonaromatic epoxy resin (B) having an epoxy equivalent of 100-400 g/eq. The nonaromatic polycarboxylic acid (A) may be obtained by reacting 1,4-cyclohexanedimethanol, 2,2-bis(4-hydroxycyclohexyl)propane, or 3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro[5,5]undecane with methylhexahydrophthalic acid or hexahydrophthalic acid.