The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7726016 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 01, 2010

Filed:

May. 26, 2004
Applicants:

Kohichi Ohsumi, Shiga-ken, JP;

Kenji Terada, Shiga-ken, JP;

Kohichi Yamazaki, Shiga-ken, JP;

Inventors:

Kohichi Ohsumi, Shiga-ken, JP;

Kenji Terada, Shiga-ken, JP;

Kohichi Yamazaki, Shiga-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a method of manufacturing a printed circuit board. The method includes the steps of preparing an insulating substrate having a front surface and a back surface and a layer of metal foil formed on each of the front surface and the back surface; selectively forming a plating layer for forming a land on at least one of the metal foils; adjusting a thickness of the plating layer; and forming the metal foils into lines.


Find Patent Forward Citations

Ohsumi, Kohichi. (2010). Manufacturing method of printed circuit board (U.S. Patent No. 7726016). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7726016

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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