The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
May. 09, 2007
Jong-hoon Kim, Hwaseong-si, KR;
Jae-jun Lee, Seongnam-si, KR;
Moon-jung Kim, Suwon-si, KR;
Kwang-soo Park, Suwon-si, KR;
Young-chan Jang, Yongin-si, KR;
Jong-Hoon Kim, Hwaseong-si, KR;
Jae-Jun Lee, Seongnam-si, KR;
Moon-Jung Kim, Suwon-si, KR;
Kwang-Soo Park, Suwon-si, KR;
Young-Chan Jang, Yongin-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor device, a method related to the semiconductor device, and a printed circuit board are disclosed. The semiconductor device includes a chip, a package including a plurality of power voltage terminals and a plurality of ground voltage terminals, wherein the chip is disposed in the package. The semiconductor device further includes an impedance circuit connected between a DC component power voltage terminal and a ground voltage, wherein the DC component power voltage terminal is one of the plurality of power voltage terminals, and an AC component interrupter connected between the DC component power voltage terminal and a power voltage. Both the AC component and a DC component of the power voltage are applied to each of the power voltage terminals except the DC component second power voltage terminal, and the ground voltage is applied to each of the ground voltage terminals.