The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2010

Filed:

Nov. 21, 2005
Applicants:

Takamitsu Sakamoto, Tokyo, JP;

Taro Oike, Tokyo, JP;

Katsuki Kurihara, Tokyo, JP;

Eric Cheuk Wing Leung, Hong Kong, CN;

Inventors:

Takamitsu Sakamoto, Tokyo, JP;

Taro Oike, Tokyo, JP;

Katsuki Kurihara, Tokyo, JP;

Eric Cheuk Wing Leung, Hong Kong, CN;

Assignees:

TDK Corporation, Tokyo, JP;

SAE Magnetics (H.K.) Ltd., Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 21/21 (2006.01);
U.S. Cl.
CPC ...
Abstract

A thin-film magnetic head that the protrusion of the head end surface due to heat generated from the heating means becomes large enough to set the magnetic spacing dto the smaller value efficiently is provided. The head comprises: a substrate having an element-formed surface on which at least one concave portion is formed and an ABS; at least one magnetic head element formed above or on the element-formed surface; at least one thermal expansion layer embedded in the at least one concave portion; and at least one heating means positioned directly above the at least one thermal expansion layer.


Find Patent Forward Citations

Loading…