The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2010

Filed:

May. 12, 2005
Applicants:

Hiroshi Kawasaki, Saitama, JP;

Ryo Furukawa, Hiroshima, JP;

Inventors:

Hiroshi Kawasaki, Saitama, JP;

Ryo Furukawa, Hiroshima, JP;

Assignee:

Technodream21, Inc., Saitama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

It is possible to measure a 3-dimensional shape by using a projector and an imaging device without requiring calibration in advance. A pattern light is applied from a projector to an object and this is imaged by an imaging device to capture an image as an input. An in-camera parameter, an in-projector parameter, a parameter of positional relationship between the camera and the projector are estimated. By using the estimation results, a 3-dimensional shape of the object is measured. When a laser pointer is attached to the projector and a laser is applied to the object for capturing an image as an input, scaling of the object shape can also be estimated. Moreover, when measuring a plurality of objects or measuring the same objects a plurality of times, the accuracy of the 3-dimensional shape respectively obtained can be increased by simultaneously processing the inputs. Moreover, when one of projector and the camera is fixed and the other is moved while measuring the same object a plurality of times, the accuracy of the 3-dimensional shape obtained as a result can be increased by performing bundle adjustment.


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