The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
May. 14, 2007
Christophe Kopp, Fontanil-Cornillon, FR;
Francois Baleras, Seyssinet, FR;
Christophe Martinez, Grenoble, FR;
Christophe Kopp, Fontanil-Cornillon, FR;
Francois Baleras, Seyssinet, FR;
Christophe Martinez, Grenoble, FR;
Commissariat a l'Energie Atomique, Paris, FR;
Abstract
This assembly of an object and a support is achieved by using solder bumps. At least two wettability areas are made respectively on an object and on a support. Each solder bump ensures electrical contact and mechanical fixing firstly to one of the wettability areas of object and secondly to one of the wettability areas of support. The melting temperature of solder bumps is lower than the melting temperature of each of the wettability areas. Each wettability area of the object forms an angle of 70° to 110° with respect to each wettability area of the support and the object and the support are mutually distant from one another.