The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
Sep. 18, 2006
Hiroki Matsumoto, Kanagawa, JP;
Hiroki Matsumoto, Kanagawa, JP;
NEC Electronics Corporation, Kanagawa, JP;
Abstract
A silica residue is generated, due to a presence of a step formed by a presence of the first layer metallic interconnect, and then, the residual silica is etched to form hollow portions when vias for the metallic interconnect provided in a layer above thereof is formed, and further, insulating materials remained above the hollow portions flakes off to create contaminants, leading to a reduction in the production yield. In the present invention, interconnects provided in a layer underlying a via group, which are provided for coupling to the upper layer interconnect layer, are disposed so as to cover vias composing its via group.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile