The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
Jun. 05, 2006
Yuji Yano, Tenri, JP;
Seiji Ishihara, Kashihara, JP;
Yuji Yano, Tenri, JP;
Seiji Ishihara, Kashihara, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
A semiconductor device includes: a base substrate; a semiconductor chip formed on the base substrate in such a manner that an adhesive layer is interposed between the semiconductor chip and the base substrate; a resin layer covering at least a portion of the semiconductor chip; and an external connection terminal electrically connected to the base substrate via a wiring layer. The external connection terminal is in the same plane as the surface of the resin layer, and is exposed from the resin layer. With this configuration, it is possible to provide a semiconductor device of a lower stage, and a stacked semiconductor device, each of which is high in connection reliability in a case of stacking plural semiconductor devices, no matter if a connection terminal of a semiconductor device stacked on an upper stage is low.