The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
Nov. 09, 2005
Toshikazu Nishida, Gainesville, FL (US);
Scott E. Thompson, Gainesville, FL (US);
AL Ogden, Gainesville, FL (US);
Kehuey Wu, Kaohsiung, TW;
Toshikazu Nishida, Gainesville, FL (US);
Scott E. Thompson, Gainesville, FL (US);
Al Ogden, Gainesville, FL (US);
Kehuey Wu, Kaohsiung, TW;
University of Florida Research Foundation, Inc., Gainesville, FL (US);
Abstract
A packaged semiconductor device () includes a semiconductor chip () having at least one selectively thinned substrate (cavity) region (). A package () is provided for mounting, enclosing and electrically connecting the chip () to the outside world, and structure for applying external stress () to induce strain in the thinned substrate region (). The external stress is preferably adjustable, such as by varying the gas flow (or a vacuum) applied through a pressure valve.