The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2010

Filed:

Feb. 23, 2007
Applicants:

Lirong Bao, Hillsborough, NJ (US);

Allison Xiao, Belle Mead, NJ (US);

Bin Wei, Matawan, NJ (US);

Inventors:

Lirong Bao, Hillsborough, NJ (US);

Allison Xiao, Belle Mead, NJ (US);

Bin Wei, Matawan, NJ (US);

Assignee:

Henkel AG & Co. KGaA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/00 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

A material for producing a conductive composition comprising polymer particles, conductive particles, and a liquid medium. The material is in a liquid/dispersion form until it is cured at which time it forms an electrically conductive composition. The composition contains larger sized polymer particles along with smaller metal conductive filler particles such as nanoparticle-sized filler particles. The larger polymer particles create excluded volume in the material matrix and reduce the percolation threshold of the conductive filler particles to provide a conductive material with a reduced volume fraction of electrically conductive filler. The electrical conductivity of the material is further increased after heat treatment which causes the conductive filler particles to sinter together to form a highly conductive network.


Find Patent Forward Citations

Loading…