The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2010

Filed:

Jun. 11, 2007
Applicants:

Yusuke Hatanaka, Haibara-gun, JP;

Tadabumi Tomita, Haibara-gun, JP;

Yoshinori Hotta, Haibara-gun, JP;

Akio Uesugi, Haibara-gun, JP;

Inventors:

Yusuke Hatanaka, Haibara-gun, JP;

Tadabumi Tomita, Haibara-gun, JP;

Yoshinori Hotta, Haibara-gun, JP;

Akio Uesugi, Haibara-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 11/06 (2006.01); B32B 3/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a microstructure wherein an aluminum member having an aluminum substrate and a micropore-bearing anodized film present on a surface of the aluminum substrate is subjected at least to, in order, a pore-ordering treatment which involves performing one or more cycles of a step that includes a first film dissolution treatment for dissolving the anodized film until a barrier layer has a thickness of 3 to 50 nm, and an anodizing treatment which follows the first film dissolution treatment; and a second film dissolution treatment for dissolving the anodized film so that a ratio of a diameter of a micropore opening 'a' to a micropore diameter at a height 'a/2' from a micropore bottom “b” (a/b) is in a range of 0.9 to 1.1, whereby the microstructure having micropores formed on a surface thereof is obtained. The manufacturing method enables microstructures having an ordered array of pits to be obtained in a short period of time.


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