The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
Dec. 12, 2006
Jules L. Routbort, Naperville, IL (US);
Dileep Singh, Naperville, IL (US);
Kenneth C. Goretta, Tokyo, JP;
Felipe Gutierrez-mora, Seville, ES;
Jules L. Routbort, Naperville, IL (US);
Dileep Singh, Naperville, IL (US);
Kenneth C. Goretta, Tokyo, JP;
Felipe Gutierrez-Mora, Seville, ES;
UChicago Argonne, LLC, Chicago, IL (US);
Abstract
A method for utilizing plastic deformation resulting from grain boundary sliding with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this approach is as strong as or stronger than the materials joined. The method does not require elaborate surface preparation or application techniques. The method also allows for the formation of transparent joints between two subunits of a construct joined via plastic deformation. The method can be used to tailor residual stresses and maintain native porosity.