The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2010

Filed:

Apr. 29, 2007
Applicants:

Nagesh Ramachandra, Balmain, AU;

Brian Robert Brown, Balmain, AU;

Norman Micheal Berry, Balmain, AU;

Garry Raymond Jackson, Balmain, AU;

Paul Timothy Sharp, Balmain, AU;

John Douglas Peter Morgan, Balmain, AU;

Kia Silverbrook, Balmain, AU;

Akira Nakazawa, Balmain, AU;

Michael John Hudson, Balmain, AU;

Christopher Hibbard, Balmain, AU;

Samuel George Mallinson, Balmain, AU;

Paul Justin Reichl, Balmain, AU;

Inventors:

Nagesh Ramachandra, Balmain, AU;

Brian Robert Brown, Balmain, AU;

Norman Micheal Berry, Balmain, AU;

Garry Raymond Jackson, Balmain, AU;

Paul Timothy Sharp, Balmain, AU;

John Douglas Peter Morgan, Balmain, AU;

Kia Silverbrook, Balmain, AU;

Akira Nakazawa, Balmain, AU;

Michael John Hudson, Balmain, AU;

Christopher Hibbard, Balmain, AU;

Samuel George Mallinson, Balmain, AU;

Paul Justin Reichl, Balmain, AU;

Assignee:

Silverbrook Research Pty Ltd, Balmain, New South Wales, AU;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P 17/00 (2006.01); B21D 53/76 (2006.01); H01S 4/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of fabricating a film for attachment of one or more printhead integrated circuits to an ink supply manifold is provided. The method comprises the steps of: (a) providing an adhesive polymeric film having a protective liner; (b) depositing photoresist onto the protective liner; (c) photopatterning the photoresist to define a plurality of openings positioned for etching supply holes through the film; (d) etching the plurality of ink supply holes through the film, the photoresist acting as a mask for the etch; and (e) removing the protective liner having the photoresist deposited thereon.


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