The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
Jan. 21, 2008
Akira Soma, Aomori, JP;
Takayuki Hayashizaki, Aomori, JP;
Yosuke Yoshizawa, Ibaraki, JP;
Hideki Hirakawa, Aomori, JP;
Akira Soma, Aomori, JP;
Takayuki Hayashizaki, Aomori, JP;
Yosuke Yoshizawa, Ibaraki, JP;
Hideki Hirakawa, Aomori, JP;
Kabushiki Kaisha Nihon Micronics, Musashino-shi, Tokyo, JP;
Abstract
A probe formed on a base table is detached from the base table without giving damage on the probe. The present invention provides a probe manufacturing method comprising the steps of forming on a sacrificial layer on a base table a recess exposing the sacrificial layer with a resist, depositing a probe material in the recess to form a probe and then removing the resist, leaving part of the sacrificial layer and removing the rest by an etching process, and detaching from the base table the probe held on the base table by the remaining part of the sacrificial layer. In the recess of the resist are formed a main body part corresponding to a flat surface shape of the probe and an auxiliary part continuing into the main body part. The probe is formed by deposition of the material at the main body part, and a holding portion is formed by deposition of the material at the auxiliary part. The auxiliary part is formed in a flat surface shape sufficient for a sacrificial layer part under the holding portion to remain when a sacrificial layer part under the probe is removed by the etching process. The probe is separated from the holding portion after the sacrificial layer part under the probe is removed and while the sacrificial layer part under the holding portion remains.