The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2010

Filed:

Apr. 19, 2006
Applicants:

Yoshitaka Sasaki, Santa Clara, CA (US);

Hiroyuki Ito, Milpitas, CA (US);

Takehiro Horinaka, Milpitas, CA (US);

Takehiro Kamigama, Shatin, HK;

Tatsushi Shimizu, Shatin, HK;

Inventors:

Yoshitaka Sasaki, Santa Clara, CA (US);

Hiroyuki Ito, Milpitas, CA (US);

Takehiro Horinaka, Milpitas, CA (US);

Takehiro Kamigama, Shatin, HK;

Tatsushi Shimizu, Shatin, HK;

Assignees:

Headway Technologies, Inc, Milpitas, CA (US);

SAE Magnetics (H.K.) Ltd., Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/127 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A thin-film magnetic head is manufactured as follows. First, a base insulating layer having a magnetic pole forming depression sunken into a form corresponding to the main magnetic pole layer is formed, a stop film for CMP is formed such as to fill the magnetic pole forming depression, and then a magnetic layer is formed on the stop film. Next, the magnetic layer is separated by forming a separation groove substantially surrounding the magnetic pole forming depression on the outside thereof, and thus separated magnetic layer is formed with a cover insulating film adapted to cover the whole upper face. The surface is polished by CMP until the stop film is exposed, so that the part of magnetic layer remaining on the inside of the magnetic pole forming depression is used as the main magnetic pole layer. Further, a recording gap layer, a write shield layer, and a thin-film coil are formed.


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