The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Mar. 07, 2006
Jong-seok Kim, Taean-eup, KR;
Duck-hwan Kim, Goyang-si, KR;
Kuang-woo Nam, Yongin-si, KR;
Yun-kwon Park, Dongducheon-si, KR;
Seok-chul Yun, Yongin-si, KR;
Sung-hoon Choa, Seoul, KR;
In-sang Song, Seoul, KR;
Jong-seok Kim, Taean-eup, KR;
Duck-hwan Kim, Goyang-si, KR;
Kuang-woo Nam, Yongin-si, KR;
Yun-kwon Park, Dongducheon-si, KR;
Seok-chul Yun, Yongin-si, KR;
Sung-hoon Choa, Seoul, KR;
In-sang Song, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A MEMS device package and a method of manufacturing the same. The MEMS device package includes a device substrate having a surface on which a MEMS active device is formed, and multiple sealing pads arranged around the MEMS active device so that the sealing pads provide electric paths for the MEMS active device. In addition, the MEMS device package may include a cap substrate bonded to the device substrate through the multiple sealing pads, the cap substrate including a trench, within which the MEMS active device is positioned, and via holes. One or more outer electrode pads may be formed on one surface of the cap substrate to be electrically connected with the multiple sealing pads through the via holes. Because there are several bonding and sealing areas between the device substrate and the cap substrate, the sealing intensity is strengthened.