The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Oct. 23, 2006
Noriyuki Yoshikawa, Osaka, JP;
Noboru Takeuchi, Kyoto, JP;
Kenichi Itou, Osaka, JP;
Toshiyuki Fukuda, Kyoto, JP;
Noriyuki Yoshikawa, Osaka, JP;
Noboru Takeuchi, Kyoto, JP;
Kenichi Itou, Osaka, JP;
Toshiyuki Fukuda, Kyoto, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A semiconductor device has upper electrodes and external terminals which are protruding above the both surfaces of a substrate for semiconductor device and connected to each other by penetrating electrodes, a first insulating film covering at least a metal pattern except for the portions of the first insulating film corresponding to the upper electrodes, a second insulating film covering at least another metal pattern except for the portions of the second insulating film corresponding to the external terminals, and a semiconductor element connected to the upper electrodes and placed on the substrate for semiconductor device. The solder-connected surface of the external terminal is positioned to have a height larger than that of a surface of the second insulating film. The semiconductor element is placed on the first insulating film and covered, together with the upper electrodes, with a mold resin.