The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Jul. 26, 2007
Katsuhiro Ishida, Yokkaichi, JP;
Hiroshi Sugiura, Yokkaichi, JP;
Makoto Hasegawa, Yokkaichi, JP;
Katsuya Ito, Yokkaichi, JP;
Katsuhiro Ishida, Yokkaichi, JP;
Hiroshi Sugiura, Yokkaichi, JP;
Makoto Hasegawa, Yokkaichi, JP;
Katsuya Ito, Yokkaichi, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor substrate, a lower wiring layer formed on the semiconductor substrate, a first interlayer insulating film formed on the lower wiring layer and including a first upper surface and a second upper surface, the first upper surface being higher than the second upper surface relative to a surface of the semiconductor substrate, a contact plug formed in the interlayer insulating film and including a first bottom surface contacting to the lower wiring layer, a third upper surface flush with the second upper surface and a fourth upper surface flush with the first upper surface, an upper wiring layer formed on the first and third upper surfaces and including a first side surface and a second side surface opposite to the first side surface, and a second interlayer insulating film formed on the second and fourth upper surfaces.