The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7719092 B1

PDF
Full Text
Expired
Date of Patent:
May. 18, 2010

Filed:

Jun. 15, 2006
Applicant:

Hiromu Takubo, Mitaka, JP;

Inventor:

Hiromu Takubo, Mitaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

The power semiconductor module includes a module package housing power semiconductor devices therein and a magnetic core set around the module package, such that magnetic core surrounds the power semiconductor devices such as IGBTs. Alternatively, the magnetic core is built in the module package such that the outer circumference faces of magnetic core and the side faces of module package form side faces of the power semiconductor module. The power semiconductor module according to the invention facilitates replacing the magnetic core, setting the magnetic core around the module package thereof, reducing the size thereof, simplifying the structure thereof, and easy manufacture thereof.


Find Patent Forward Citations

Takubo, Hiromu. (2010). Power semiconductor module (U.S. Patent No. 7719092). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7719092

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