The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2010

Filed:

Jan. 22, 2007
Applicant:

Shoufang Chen, Hsin-Chu Hsien, TW;

Inventor:

ShouFang Chen, Hsin-Chu Hsien, TW;

Assignee:

MStar Semiconductor, Inc., ChuPei, Hsin-Chu Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/111 (2006.01); H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides an integrated circuit and the method of implementing the same. The integrated circuit includes a die, a base, a covering material and a plurality of pins. The die has at least a first function and a second function and includes a plurality of signal pads and at least a switching pad. The die receives and outputs signals through the signal pads, and the switching pad is utilized to switch the functions of the die. The base is utilized to support the die, and the covering material is utilized to cover the die and the base. One terminal of each pin is inside the covering material and coupled to the corresponding signal pad, and the other terminal of each pin is outside the covering material. The signal pads are connected to the circuits outside the integrate circuit through the pins.


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