The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Mar. 14, 2006
Harold B. Kent, Portola Valley, CA (US);
James J. Levante, Redwood City, CA (US);
Aaron T. Fine, San Jose, CA (US);
Joseph R. Layton, Sunnyvale, CA (US);
Harold B. Kent, Portola Valley, CA (US);
James J. Levante, Redwood City, CA (US);
Aaron T. Fine, San Jose, CA (US);
Joseph R. Layton, Sunnyvale, CA (US);
MEDCONX, Inc., Santa Clara, CA (US);
Abstract
A micro solder pot includes a dielectric substrate having at least one hole formed therein, a conductive coating coupled to the interior of the hole, and at least one heat transfer pad spaced from the hole in thermal communication with the conductive coating of the hole. When the heat transfer pad is exposed to a heat source, the conductive coating inside the hole is heated. The micro solder pot may also include a thermally activated conductive material disposed within the hole. When the heat transfer pad is exposed to a heat source, the thermally activated conductive material becomes liquidus such that a component can be inserted into the liquidus material. When the heat source is removed, the thermally activated conductive material cools to couple the component to the conductive coating in the hole.