The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2010

Filed:

Dec. 09, 2004
Applicants:

Katsuhiro Ando, Akashi, JP;

Shintaro Komitsu, Takasago, JP;

Inventors:

Katsuhiro Ando, Akashi, JP;

Shintaro Komitsu, Takasago, JP;

Assignee:

Kaneka Corporation, Osaka-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 77/00 (2006.01); C08L 63/00 (2006.01); C08L 83/00 (2006.01); B32B 27/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention aims to improve surface tackiness of a curable composition comprising a reactive silicon group-containing polyoxypropylene polymer without decreasing coating workability, strength, adhesion and appearance. As one embodiment of a means for resolution, a curable composition comprising (A) 100 parts by weight of a reactive silicon group-containing polyoxypropylene polymer, (B) from 0.1 to 20 parts by weight of a silane coupling agent, (C) from 0.1 to 80 parts by weight of an epoxy group-containing compound, (D) from 0.1 to 60 parts by weight of a tertiary amine, and (E) from 0.1 to 30 parts by weight of a primary or secondary amine having a melting point of 20° C. or more is mentioned.


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