The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Dec. 19, 2008
Kimoon Kim, Pohang, KR;
Kangkyun Baek, Pohang, KR;
Jeeyeon Kim, Pohang, KR;
Ilha Hwang, Pohang, KR;
Young Ho Ko, Pohang, KR;
Narayanan Selvapalam, Pohang, KR;
Erumaipatty R. Nagarajan, Pohang, KR;
Kyeng Min Park, Pohang, KR;
Kimoon Kim, Pohang, KR;
Kangkyun Baek, Pohang, KR;
Jeeyeon Kim, Pohang, KR;
Ilha Hwang, Pohang, KR;
Young Ho Ko, Pohang, KR;
Narayanan Selvapalam, Pohang, KR;
Erumaipatty R. Nagarajan, Pohang, KR;
Kyeng Min Park, Pohang, KR;
Postech Foundation, Pohang, Kyungsangbuk-do, KR;
Abstract
Provided are a kit including a first component that is a compound of formula (1) below bound to a first material and a second component that is a ligand bound to a second material, wherein each of the first and second materials is independently selected from the group consisting of a solid phase, a biomolecule, an antioxidant, a chemical therapeutic agent, an anti-histaminic agent, a cucurbituril dendrimer, a cyclodextrin derivative, a crown ether derivative, a calixarene derivative, a cyclophane derivative, a cyclic peptide derivative, a metallic ion, a chromophore, a fluorescent material, a phosphor, a radioactive material, and a catalyst; and the ligand can non-covalently bind to the compound of formula (1); a method of separating and purifying a material bound to a ligand using the compound of formula (1) bound to a solid phase; a method of separating and purifying the compound of formula (1) or a material bound to the compound using a ligand bound to a solid phase; a sensor chip including a compound of formula (1) bound to a first material and a ligand bound to a second material; and a solid-catalyst complex including the compound of formula (1) bound to a first material and a ligand bound to a second material.