The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Sep. 03, 2001
Koichi Watanabe, Kanagawa, JP;
Yoichiro Yabe, Kanagawa, JP;
Takashi Ishigami, Kanagawa, JP;
Takashi Watanabe, Kanagawa, JP;
Hitoshi Aoyama, Kanagawa, JP;
Yasuo Kohsaka, Kanagawa, JP;
Yukinobu Suzuki, Kanagawa, JP;
Koichi Watanabe, Kanagawa, JP;
Yoichiro Yabe, Kanagawa, JP;
Takashi Ishigami, Kanagawa, JP;
Takashi Watanabe, Kanagawa, JP;
Hitoshi Aoyama, Kanagawa, JP;
Yasuo Kohsaka, Kanagawa, JP;
Yukinobu Suzuki, Kanagawa, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A method of manufacturing a tungsten sputtering target includes pressing a high purity tungsten powder to form a pressed compact, first sintering the pressed compact at a temperature of 1450-1700° C. for one hour or longer after the pressed compact is heated at a heating-up rate of 2-5° C./min on the way to a maximum sintering temperature, second sintering the pressed compact to form a sintered body at a temperature of 1900° C. or higher for 5 hours or longer, working the sintered body to obtain a shape of a target, subjecting the target to a grinding work of at least one of rotary grinding and polishing, and subjecting the target to a finishing work of at least one of etching and reverse sputtering.