The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Sep. 08, 2003
John Chen, Danville, CA (US);
Kwok Fai Lai, Kowloon, HK;
Kuok Sang Leong, Kowloon, HK;
Man Tat Yip, Kowloon, HK;
Wai Shun Leung, Kowloon, HK;
Chun Wing NG, Kowloon, HK;
Quincy Lee, Kowloon, HK;
John Chen, Danville, CA (US);
Kwok Fai Lai, Kowloon, HK;
Kuok Sang Leong, Kowloon, HK;
Man Tat Yip, Kowloon, HK;
Wai Shun Leung, Kowloon, HK;
Chun Wing Ng, Kowloon, HK;
Quincy Lee, Kowloon, HK;
Bel Fuse, Inc., Jersey City, NJ (US);
Abstract
A multiport connector which includes a housing having at least two aligned compartments, each compartment being structured and arranged to receive respective plugs. A multilayer printed wiring board separates the two compartments, the printed wiring board having circuit patterns on opposite sides of opposed non-conductive layers and a metal shielding layer intermediate the non-conductive layers. A first plurality of conductive contact fingers is disposed in one of the compartments, the first plurality of fingers having first portions for making electrical contact with one of the plugs and second portions for making contact with the circuit pattern on one of the non-conductive layers of the multilayer printed wiring board. A second plurality of conductive contact fingers is disposed in the other of the compartments, the second plurality of fingers having first portions for making electrical contact with the other one of the plugs and second portions for making contact with the circuit pattern on the other one of the non-conductive layers of the multilayer printed wiring board.