The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Jan. 06, 2006
Po-hsun Sung, Jhudong Township, Hsinchu County, TW;
Wen-wang KE, Jhudong Township, Hsinchu County, TW;
Nai-hao Kuo, Jhudong Township, Hsinchu County, TW;
Yu-sheng Hsieh, Jhudong Township, Hsinchu County, TW;
Po-Hsun Sung, Jhudong Township, Hsinchu County, TW;
Wen-Wang Ke, Jhudong Township, Hsinchu County, TW;
Nai-Hao Kuo, Jhudong Township, Hsinchu County, TW;
Yu-Sheng Hsieh, Jhudong Township, Hsinchu County, TW;
Industrial Technology Research Institute, Hsinchu County, TW;
Abstract
An acoustic wave sensing device integrated with micro-channels and a method for the same are described. The present invention uses a piezoelectric substrate with a thinner portion serving as a sensing area and formed via a micromaching or chemical process. An inter-digital transducer (IDT) is located on the thinner portion to produce flexural plate waves (FPW). The micro-channels can be formed together with the thinner portion via the same manufacturing process, or integrated into the piezoelectric substrate via linkage. In the present invention, a novel manufacturing process and design are proposed for fabrication of the acoustic wave sensing devices with a good piezoelectric characteristic, a stable temperature compensation property, and a robust structure. Thereby, the techniques of flexural plate waves can be applied for liquid sensors. In this way, the drawbacks of the conventional acoustic wave sensing devices, such as poor piezoelectric properties and fragile film structures, are removed.