The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Dec. 09, 2002
Keiichi Murakami, Komaki, JP;
Keiichi Murakami, Komaki, JP;
Noda Screen Co., Ltd., Aichi, JP;
Abstract
A method for manufacturing a printed wiring board, including forming a thermosetting resin layer on the printed wiring board; heating and curing the resin layer; and then polishing the cured resin layer, thereby exposing the circuit patterns. Additionally, the step of heating and curing includes maintaining the resin layer at a non-curable temperature in a state where the resin layer is pressed via the smoothing plate in a reduced pressure chamber; heating the resin layer in the pressed state to a curing temperature; introducing outside air into the reduced pressure chamber with the pressed state and the curing temperature maintained; reducing the pressure applied to the smoothing plate with the curing temperature maintained; and cooling the resin layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile