The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Apr. 08, 2004
Applicants:
Neal Meyer, Corvallis, OR (US);
Ronald Hellekson, Eugene, OR (US);
Ronnie Yenchik, Blodgett, OR (US);
Inventors:
Neal Meyer, Corvallis, OR (US);
Ronald Hellekson, Eugene, OR (US);
Ronnie Yenchik, Blodgett, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract
This disclosure relates to a system and method for bonding an interconnect to a dense circuit device with a mechanically clamping substrate.
Meyer, Neal. (2010). Bonding an interconnect to a circuit device and related devices (U.S. Patent No. 7716823). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7716823
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile