The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2010
Filed:
Oct. 29, 2008
Applicants:
Joon-seo Son, Seoul, KR;
O-soeb Jeon, Seoul, KR;
Inventors:
Joon-seo Son, Seoul, KR;
O-soeb Jeon, Seoul, KR;
Assignee:
Fairchild Korea Semiconductor Ltd., Buchon, Kyungki-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided are semiconductor packages and methods of fabricating the same. An exemplary semiconductor package includes a die pad including a dimple filled with an insulating material in an upper surface or a lower surface thereof. A semiconductor chip is mounted on the upper surface of the first die pad. A package body encapsulates the first die pad and the first semiconductor chip and includes a pinhole. A bottom surface of the pinhole terminates at the insulating material.