The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2010

Filed:

May. 06, 2008
Applicant:

Terunao Hanaoka, Suwa, JP;

Inventor:

Terunao Hanaoka, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01F 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes: a semiconductor substrate that has an integrated circuit and an electrode, the electrode being electrically coupled to the integrated circuit; a resin layer that is formed on the semiconductor substrate, the resin layer having an upper surface and a lower surface, the upper surface and the lower surface opposing each other, the lower surface facing the substrate; and a spiral inductor that is formed on the upper surface of the resin layer with a spiral wiring line, the spiral inductor being electrically coupled to the electrode. The wiring line has both ends in a width direction intersecting an axial line spirally extending and a mid-portion between the both ends. At least a part of the mid-portion makes contact with the upper surface of the resin layer, and at least the both ends are positioned apart from the upper surface of the resin layer.


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