The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2010
Filed:
Aug. 09, 2006
Thomas B. Richardson, Killingworth, CT (US);
Marlies Kleinfeld, Wuppertal, DE;
Christian Rietmann, Sonsbeck, DE;
Igor Zavarine, New Haven, CT (US);
Ortrud Steinius, Wuppertal, DE;
Yun Zhang, Warren, NJ (US);
Joseph A. Abys, Warren, NJ (US);
Thomas B. Richardson, Killingworth, CT (US);
Marlies Kleinfeld, Wuppertal, DE;
Christian Rietmann, Sonsbeck, DE;
Igor Zavarine, New Haven, CT (US);
Ortrud Steinius, Wuppertal, DE;
Yun Zhang, Warren, NJ (US);
Joseph A. Abys, Warren, NJ (US);
Enthone Inc., West Haven, CT (US);
Abstract
A process for forming a solder bump on an under bump metal structure in the manufacture of a microelectronic device comprising exposing the under bump metal structure to an electrolytic bath comprising a source of Snions, a source of Agions, a thiourea compound and/or a quaternary ammonium surfactant; and supplying an external source of electrons to the electrolytic bath to deposit a Sn—Ag alloy onto the under bump metal structure.