The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2010
Filed:
Nov. 01, 2007
Hironori Takahashi, Nagoya, JP;
Masayuki Hironaga, Tokai, JP;
Hironori Takahashi, Nagoya, JP;
Masayuki Hironaga, Tokai, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
A die for forming a honeycomb structure includes a die base having a first plate-like member and a second plate-like member, the first plate-like member is provided with groove portions on the side of a bonding surface between the first plate-like member and the second plate-like member, and a depth y (mm) of the groove portions satisfies:·(1×1+2×2)/(1×2×1×2)where t1 is a thickness (mm) obtained by subtracting the depth (mm) of the groove portions from a thickness (mm) of the first plate-like member, E1 is an apparent volume elasticity (GPa) of the first plate-like member at 25° C. in consideration of a state in which back holes are formed, t2 is a thickness (mm) of the second plate-like member, E2 is a volume elasticity (GPa) of the second plate-like member at 25° C., and a is a coefficient determined based on conditions during manufacturing.