The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 11, 2010

Filed:

May. 03, 2007
Applicants:

Takeshi Morita, Fukuoka, JP;

Masanori Hiyoshi, Fukuoka, JP;

Inventors:

Takeshi Morita, Fukuoka, JP;

Masanori Hiyoshi, Fukuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

First components and second components in which bumps are formed on the lower surface thereof and laminate structures are formed by mounting them to stack with each other on a circuit boardare picked up from a component supply unitusing a placement head, and by lifting and lowering the placement headholding the first components and the second components relative to a paste transfer devicesupplying a fluxin the manner such as coating films having two types of different thicknesses, the fluxis supplied to the bumps of the plurality of components in a bundle using a transfer coating method. With such a configuration, it is possible to efficiently perform a component mounting with a satisfactory adhesiveness by ensuring an optimal amount of application quantity of a paste.


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