The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2010
Filed:
Feb. 17, 2006
Takayoshi Matsumura, Kawasaki, JP;
Kenji Kobae, Kawasaki, JP;
Norio Kainuma, Kawasaki, JP;
Kimio Nakamura, Kawaki, JP;
Takayoshi Matsumura, Kawasaki, JP;
Kenji Kobae, Kawasaki, JP;
Norio Kainuma, Kawasaki, JP;
Kimio Nakamura, Kawaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
When a semiconductor chip is mounted using ultrasonic vibration, a method of mounting makes it possible to bond the semiconductor chip and bonding patterns with sufficient bonding strength without making the construction of a circuit board complex. The method of mounting a semiconductor chip causes ultrasonic vibration to act on the semiconductor chip to mount the semiconductor chip on a circuit board by flip-chip bonding. As the circuit board, a circuit board is used where protrusion patterns are provided at positions on bonding patterns to which the semiconductor chip is bonded corresponding to antinodes of vibration for a case where the bonding patterns resonate due to ultrasonic vibration applied by the semiconductor chip.