The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2010
Filed:
Oct. 22, 2004
Naoichi Chikahisa, Mino, JP;
Hiroshi Yamauchi, Katano, JP;
Jun Shirai, Toyonaka, JP;
Toshiaki Yamauchi, Yawata, JP;
Yoshiyuki Fujita, Niihama, JP;
Masanori Iwasaki, Higashiosaka, JP;
Naoichi Chikahisa, Mino, JP;
Hiroshi Yamauchi, Katano, JP;
Jun Shirai, Toyonaka, JP;
Toshiaki Yamauchi, Yawata, JP;
Yoshiyuki Fujita, Niihama, JP;
Masanori Iwasaki, Higashiosaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In printing of a bonding material in which a board is supported from a component mounting-side surface on which a plurality of components are mounted, and a bonding material is printed on a working-side surface which is a surface opposed to the component mounting-side surface of the board, an edge portion region of the board supported by a board transporting unit is included in a support region of the board during the printing so as to enlarge the support region of the board having the components mounted thereon in high density and to achieve reliable and high precision printing of the bonding material.