The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2010
Filed:
Oct. 24, 2006
Nicholas E. Brathwaite, Hayward, CA (US);
Ram Gopal Bommakanti, Fremont, CA (US);
Visvanathan Ganapathy, Santa Clara, CA (US);
Paul N. Burns, San Jose, CA (US);
Douglas Edward Maddox, Santa Cruz, CA (US);
Michael Anthony Durkan, Carrigaline, IE;
Nicholas E. Brathwaite, Hayward, CA (US);
Ram Gopal Bommakanti, Fremont, CA (US);
Visvanathan Ganapathy, Santa Clara, CA (US);
Paul N. Burns, San Jose, CA (US);
Douglas Edward Maddox, Santa Cruz, CA (US);
Michael Anthony Durkan, Carrigaline, IE;
Flextronics International USA, Inc., Milpitas, CA (US);
Abstract
A method for designing an electronic component includes receiving a device criteria (e.g., a parametric value, procurement value, etc.) from a designer, querying a database for devices corresponding to the device criteria, querying the database for procurement data and/or engineering data associated with the corresponding devices, presenting the devices to the designer based on the procurement data, and receiving input from the designer identifying one of the presented devices as a selected device. In a particular method, the returned devices are sorted based on one or more procurement values (e.g., manufacturer, price, availability, manufacturer status, etc.), and presented to the designer in a ranked list. Objects representative of the selected devices are then entered into a design file, and the objects are associated with the device's engineering and/or procurement data. In a particular embodiment, the objects are associated with the engineering data by embedding the engineering data in the file object. Optionally, data can be associated with the objects via links to the database. Types of engineering data that can be associated with design file objects include, but are not limited to, device footprint data, device pinout data, device physical dimension data, parametric data, and packaging data. Additionally, connection data and annotation data can be entered into the design file objects by the designer.