The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2010
Filed:
Feb. 08, 2005
Toshikazu Imaoka, Ogaki, JP;
Takeshi Yamaguchi, Gunma, JP;
Ryosuke Usui, Ichinomiya, JP;
Hiroyuki Watanabe, Bisai, JP;
Toshimichi Naruse, Gunma, JP;
Atsushi Kato, Kiryu, JP;
Toshikazu Imaoka, Ogaki, JP;
Takeshi Yamaguchi, Gunma, JP;
Ryosuke Usui, Ichinomiya, JP;
Hiroyuki Watanabe, Bisai, JP;
Toshimichi Naruse, Gunma, JP;
Atsushi Kato, Kiryu, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A semiconductor pellet and chip components are provided on an insulating substrate, and are sealed with a molding resin that is molded by transfer molding. The chip components are positioned so as to surround the semiconductor pellet on all four sides. The lengthwise directions of the chip components surrounding the semiconductor pellet are aligned in a uniform direction. The insulating substrate is set within a die molding apparatus so that during resin injection, the lengthwise directions of the chip components are aligned substantially perpendicularly to the direction of flow of the injected resin.