The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2010
Filed:
Apr. 24, 2006
Applicants:
Shaoher X. Pan, San Jose, CA (US);
Wald Siskens, Palo Alto, CA (US);
Inventors:
Shaoher X. Pan, San Jose, CA (US);
Wald Siskens, Palo Alto, CA (US);
Assignee:
Spatial Photonics, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A packaged die includes a substrate having an upper surface and a micro device on the upper surface and an encapsulation cover comprising one or more grooves on its lower surface. The lower surface of the encapsulation cover and the upper surface of the substrate are bonded together to form a plurality of air-tight closed-loop interfaces and encapsulate the micro device.
Pan, Shaoher. (2010). Micro device encapsulation (U.S. Patent No. 7709940). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7709940
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile