The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2010
Filed:
Aug. 16, 2006
Hiroshi Yamanaka, Moriguchi, JP;
Tsutomu Ichihara, Hirakata, JP;
Yoshifumi Watabe, Tondabayashi, JP;
Koji Tsuji, Suita, JP;
Masao Kirihara, Kadoma, JP;
Takaaki Yoshihara, Osaka, JP;
Yoichi Nishijima, Osaka, JP;
Satoshi Hyodo, Ashiya, JP;
Hiroshi Yamanaka, Moriguchi, JP;
Tsutomu Ichihara, Hirakata, JP;
Yoshifumi Watabe, Tondabayashi, JP;
Koji Tsuji, Suita, JP;
Masao Kirihara, Kadoma, JP;
Takaaki Yoshihara, Osaka, JP;
Yoichi Nishijima, Osaka, JP;
Satoshi Hyodo, Ashiya, JP;
Panasonic Electric Works Co., Ltd., Osaka, JP;
Abstract
An infrared sensor unit has a thermal infrared sensor and an associated semiconductor device commonly developed on a semiconductor substrate. A dielectric top layer covers the substrate to conceal the semiconductor device formed in the top surface of the substrate. The thermal infrared sensor carried on a sensor mount which is supported above the semiconductor device by means of a thermal insulation support. The sensor mount and the support are made of a porous material which is superimposed on top of the dielectric top layer.