The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7709401 B1

PDF
Full Text
Expired
Date of Patent:
May. 04, 2010

Filed:

Feb. 22, 2008
Applicants:

Fen Chen, Williston, VT (US);

Cathryn Jeanne Christiansen, Huntington, VT (US);

Michael Anthony Shinosky, Jericho, VT (US);

Timothy Dooling Sullivan, Underhill, VT (US);

Inventors:

Fen Chen, Williston, VT (US);

Cathryn Jeanne Christiansen, Huntington, VT (US);

Michael Anthony Shinosky, Jericho, VT (US);

Timothy Dooling Sullivan, Underhill, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/477 (2006.01); H01L 21/4763 (2006.01); H01L 21/469 (2006.01); H01L 21/768 (2006.01); H01L 23/485 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
Abstract

An interconnect and method of making the interconnect. The method includes forming a dielectric layer on a substrate, the dielectric layer having a top surface and a bottom surface; forming a first wire and a second wire in the dielectric layer, the first wire separated from the second wire by a region of the dielectric layer; and forming metallic nanoparticles in or on the top surface of the dielectric layer between the first and second wires, the metallic nanoparticles capable of electrically connecting the first wire and the second wire only while the nanoparticles are heated to a temperature greater than room temperature and a voltage is applied between the first and second wires.


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